• Boric Acid

Boric Acid is an essential constituent of nickel plating solutions. It is added to buffer the pH of the solution, especially in the proximity of the cathode surface where metal deposition takes place.

To meet the high quality standards and materials safety standards required for electroforming, Hart Materials markets high purity Boric Acid securely packaged in small quantities of 10 kg. This helps to avoid contamination during storage.

For more information on Boric Acid, please contact us

 

Nickel Electroforming Materials

Safety Data Sheet

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